Kuala Lumpur, May 30, 2024 – Manz AG, a global leader in high-tech equipment manufacturing, successfully showcased its latest advancements in RDL (Redistribution Layer) production equipment and solutions at SEMICON Southeast Asia 2024. The event, held at MITEC from May 28-30, highlighted Manz AG's innovative technologies that empower customers to enhance their competitive edge and fortify their supply chains.
Pioneering Advancements in Advanced Packaging Technology
As the fields of artificial intelligence and high-performance computing continue to evolve, Manz AG is leading the way in advanced packaging technology. The company's latest innovations promote the miniaturization and enhanced functionality of integrated silicon chips, enabling high-density I/O connections and fine-pitch line spacing in RDL. This drive for progress is advancing the development of Panel-Level Packaging, tackling critical technological challenges with cutting-edge solutions.
Transforming the RDL Process
Manz AG's state-of-the-art RDL process solutions integrate advanced wet chemistry technology to deliver superior electroplating surface uniformity and thickness, thereby enhancing chip density and heat dissipation. These solutions support high-density manufacturing and offer cost-effective maintenance through innovative equipment designs. Multi-anode system configurations further maximize uniformity and line spacing.
The introduction of digital printing solutions marks a significant leap forward in RDL production, enabling precise placement of electronic materials and improving production efficiency. These advancements streamline the manufacturing process by reducing steps and increasing throughput, all while promoting environmental sustainability through reduced chemical usage and energy consumption.
Advancing Industrialization and Sustainability
Manz AG is unwavering in its commitment to research and development, providing robust support for stable mass production to leading printed circuit board and panel manufacturers globally. By fostering collaboration and tailoring solutions to meet specific customer needs, Manz AG accelerates the adoption of diverse processes and materials, driving technological innovation in the advanced packaging market.
Mr. Robert Lin, General Manager of Manz AG Asia, states: "Manz AG is dedicated to fostering innovation and competitiveness in the advanced packaging industry. By offering market-oriented RDL process equipment and efficient production solutions, we empower our customers to thrive in a rapidly evolving landscape."
Looking ahead, Manz AG is focused on promoting the industrialization of panel-level packaging while prioritizing green process equipment and energy efficiency. Whether addressing single equipment needs or fully automated fab integration, Manz AG remains committed to advancing the industry and minimizing environmental impact.
This article is provided by Manz AG.
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